Brief introduction:
| model: | HongJin-H1817 |
| Specification: | 30G/branch |
| characteristic: | HongJin H1817 is a one-component fast-curing epoxy resin adhesive with good flow and workability. At the same time, the product can form excellent adhesion between many different types of materials. At the same time, it is a high-temperature-resistant glue that can pass reflow soldering. It can still maintain a good bonding effect when it passes through 260-degree reflow soldering, and its waterproof level can exceed level 7. |
| Applicable Products: | Watertight sealing and structural bonding of consumer and industrial electronics |
Technical parameter:
Attributes | magnitude |
type | epoxy glue |
viscosity（at 25°） | 8000±1000 (mPa·s) |
density（g/cm3） | 1.2±0.15 |
hardness（Shaw BrothersD） | 80+/-15 |
Shear force（MPa）（Fe/Fe） | 8 Min. |
water absorption | <1.5% |
Curing rate | 100% |
Operation time（After opening） | 12H |
Precautions:
1、Please store glue at -20 degrees.
2、Warm up the glue at room temperature for 2 hours before use.
3、Before bonding, the bonding surface must be kept clean and free from water, oil, rust, etc. Better after sanding.
4、After dispensing, please strictly follow the conditions recommended in the specification.
Landline ：0755-28307837
Mail ：sales@szhjtec.com
contact ：吳先生 18688927121
王先生 13332958891
address ：深圳市龍崗區(qū)坪地街道教育北路49號(hào)5B棟501
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