HongJin-H1851 One-component epoxy resin adhesive

Brief introduction

model	HongJin-H1851
Specification	30g/branch
characteristic	HongJin H1851 is a one-component epoxy resin adhesive with good flow and workability. At the same time, the product can form excellent bonds between many different types of materials. At the same time, it is a high-temperature-resistant glue that can pass reflow soldering. It can still maintain a good bonding effect when it passes through 260-degree reflow soldering, and its waterproof level can exceed level 4.
Applicable Products	Automotive connectors, mobile phone connectors and various products that require reflow soldering

Technical parameter

Attributes	magnitude
type	epoxy glue
viscosity（at 25°）	6300±1500 (mPa·s)
density（g/cm³）	1.5±0.20
hardness（Shaw BrothersD）	80+/-10
Shear force（MPa）（Fe/Fe）	4 Min
water absorption	<1.5%
Dielectric constant（1MHz）	2.8
surface resistance（Ω）	1.5×10¹⁶
Operation time（After opening）	12H

Precautions

1、Please store glue at -20 degrees.

2、Warm up the glue at room temperature for 2 hours before use.

3、Before using glue, use it in small quantities to avoid massive problems.

4、Before bonding, the bonding surface must be kept clean and free from water, oil, rust, etc. Better after sanding.

5、Baking after dispensing, please strictly follow the conditions recommended in the specification

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